Heat-Sensitive Device Use Case
ETO Sterilizer for Heat-Sensitive Medical Devices
Many medical instruments and devices are damaged by the heat and moisture of steam autoclaving and require a low-temperature alternative.
The challenge
Many medical instruments and devices are damaged by the heat and moisture of steam autoclaving and require a low-temperature alternative.
Why SSQ fits this application
Ethylene oxide sterilization is a low-temperature process suitable for many heat- and moisture-sensitive instruments.
SSQ offers PurETO+ for higher-throughput applications and PurETO Elica for compact EO gas sterilization.
What to evaluate
Recommended products
ETO Sterilizer
PurETO+
A hospital-scale EO gas sterilizer for controlled low-temperature processing of heat- and moisture-sensitive medical devices.
View productETO Sterilizer
PurETO Elica
A compact table top EO gas sterilizer for low-temperature processing where space, usability, and repeatable cycle control matter.
View productH2O2 Plasma Sterilizer
EiligPlaz
A low-temperature H2O2 plasma sterilizer for compatible laparoscopic, ophthalmic, and delicate surgical instruments.
View productFrequently asked questions
Low-temperature methods such as ETO sterilization and H2O2 plasma sterilization are used for compatible heat-sensitive devices. The right method depends on the instrument and validated application.
Selection depends on device material, packaging, instrument design, chamber volume, cycle needs, and validated compatibility. SSQ can help review the use case before recommending a product.
Low-temperature methods are used for heat-sensitive devices: EO sterilization for broad material and packaging compatibility, and H2O2 plasma for fast, low-moisture processing of compatible instruments.
EO sterilization is a low-temperature, low-moisture process suitable for many moisture-sensitive devices that cannot tolerate steam, subject to validated compatibility.
Discuss your requirement with our team
Request a quote, brochure, or model recommendation tailored to your facility, load profile, and instrument compatibility needs.